The BUD Fund Seminar
Easy BUD Form-Filling Tips for Exhibition Measure
The Dedicated Fund on Branding, Upgrading and Domestic Sales (BUD Fund) is to provide funding support for Hong Kong enterprises in exploring and developing in Chinese Mainland and specific overseas markets through developing brands, upgrading and restructuring their operations and promoting domestic sales. To further support SMEs, enhancement measures were introduced on 15 June 2026. The SME Export Marketing Fund (EMF) was consolidated into the BUD Fund from 1 July 2026, enterprises can participate in exhibitions outside Hong Kong and export marketing activities through the BUD Fund - Easy BUD for market expansion. In addition, targeted funding support will be provided for AI-related measures, assisting enterprises in enhancing their competitiveness.
As the implementer, HKPC will conduct a seminar to cover ‘Easy BUD’ eligibility and application procedures, form‑filling guidance, exhibition and AI application case studies, and provide on‑site one‑to‑one consultation to support your application.
Highlights:
🎯Application eligibility, procedures, and notes for form-filling
🤖 Funding support for AI-related measures and AI application case studies
💡Strategies & tips for filling the online application form
🤝Free one-on-one consultation
🌟On-site account opening support
Register now! Get a head start for business funding!
Event Details
22 October 2026
15:00 - 17:00
Inno Network, 1/F, HKPC Building, 78 Tat Chee Avenue, Kowloon
Cantonese
SMEs that planning to expand into Chinese Mainland and specific overseas markets
Event Rundown
Introduction on the BUD Fund |
Application eligibility, procedures, and notes for form-filling |
One-on-one Consultation (consultation token will be distributed at the registration reception on the event date)*For companies with multiple attendees wishing to attend the seminar, please use a unique email address for each registration. Kindly note that only one seat will be reserved if the same email is used for multiple registrations. |
On-site account opening for the online application platform
Enrolment
Disclaimer:
Any opinions, findings, conclusions or recommendations expressed in this material/event (or by members of the project team) do not reflect the views of the Government of the Hong Kong Special Administrative Region.
Inquiry:
BUD Fund | +852 2788 6088 | bud_sec@hkpc.org